Panasonic Network Card 2SC5378 User Manual

Transistor  
2SC5378  
Silicon NPN epitaxial planer type  
For low-voltage low-noise high-frequency oscillation  
Unit: mm  
2.1±0.1  
Features  
Low noise figure NF.  
025  
1.25±0.1  
0.425  
High gain.  
High transition frequency fT.  
3
S-Mini type package, allowing downsizing of the equipment and  
automatic insertion through the tape packing and the magazine  
packing.  
2
Absolute Maximum Ratings (Ta=25˚C)  
Parameter  
Symbol  
VCBO  
VCEO  
VEO  
IC  
Rating
U
V
0.2±0.1  
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
15  
V
1:Base  
2:Emitter  
3:Collector  
2
80  
V
EIAJ:SC–70  
S–Mini Type Package  
mA  
mW  
˚C  
Collector power dissipation  
Junction temperature  
Storage temperature  
C  
150  
Marking symbol : HT  
Tj  
150  
tg  
–55 ~
C  
Elecricl Chcteristics (Ta=5˚C)  
Parameter  
ymol  
ICBO  
IEBO  
Conditns  
min  
typ  
max  
1
Unit  
µA  
Colector cuf current  
Emittecutoff c
Forward curren
Collector output ca
Transition frequency  
Noise figure  
VCB = 10V, IE = 0  
VEB = 1V, IC = 0  
CE = 5V, IC = 10mA  
1
µA  
*1  
hFE  
Cob  
fT  
V
80  
200  
1
VCB = 5V, IE = 0, f = 1MHz  
0.6  
7
pF  
GHz  
dB  
VCE = 5V, IC = 10mA, f = 2GHz  
VCE = 5V, IC = 3mA, f = 1GHz  
VCE = 5V, IC = 10mA, f = 1GHz  
NF  
| S21e  
1.6  
11  
2
2
Foward transfer gain  
|
8.5  
dB  
*1  
h
Rank classification  
FE  
Rank  
hFE  
Q
R
S
80 ~ 115  
95 ~ 155  
135 ~ 200  
1
 
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipmentcombustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change ut noice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, herere, ask for the ost up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your reqrements.  
(5) When designing your equipment, comply with the range of absolute amum rating and the guaraing conditions  
(operating power supply voltage and operating environment etc.). Espcially, ease be careful noexcange of absolute  
maximum rating on the transient state, such as power-on, power-off ad mode-switching. Othwe will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed vales, tanto the consideration of indence of break down and failure  
mode, possible to occur to semiconductor products. Measures on stems such as redundat design, arresting the spread of fire  
or preventing glitch are recommended in order to prevnt hysicy, fire, social dmages, fr example, by usig the products.  
(6) Comply with the instructions for use in order to preent breakdown and chaacterists change due to extenal factors (ESD, EOS,  
thermal stress and mechanical stress) at the of hdling, mounting or customerprocess. When using products for which  
damp-proof packing is required, satisfy thions, such as shelf life nd the lapsed time since first opening the packages.  
(7) This book may be not reprinted oprodued wether wholly or prtially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
 

Miele Clothes Dryer t 260 User Manual
Multi Tech Systems Video Games S000573A User Manual
Nady Systems Microphone OHCM 20 User Manual
National Instruments Network Router WAP 3701 User Manual
NEC Flat Panel Television LCD4215 User Manual
NEC Laptop M380 User Manual
Oregon Scientific Heart Rate Monitor SE102 User Manual
Outback Power Systems Battery Charger GTFX2524 User Manual
Panasonic Air Conditioner CS MC12DKU User Manual
Panasonic Answering Machine kX TG2323C User Manual